Special processes

• Automatic assembly with short cycle times
• Thick wire bonding
• Laser welding of aluminum, steel, and plastics
• Plasma cleaning
• Laser soldering
• Standard SMD technology with inline laser marking, 3D paste scan, 3D post reflow AOI and traceability (complete traceability of components and processes)
• Automated separation of printed circuit boards by means of side milling cutters or finger milling cutters
• Automated ICT testing and programming of printed circuit boards
• Automated and force-path controlled pressing of contact pins into printed circuit boards (pressfit)
• Partial painting of printed circuit boards

ProcessesGlobal leading plant responsible for:

• Finest dosing of conductive paste/grease
• Contour application of heat conductive adhesive
• Hot stamp and hot jet plastic rivets
• Thermography testing
• Calibration milling of LED printed circuit boards
• Wave soldering
• Mini or selective wave soldering
• Printed circuit board X-rays
• Painting of PCB printed circuit boards
• Structure-borne sound test
• Ultrasonic welding
• Laser marking (printed circuit boards, plastic, metal, die casting, etc.)

Core products

• Electronic control units for LED headlamps and adaptive front-lighting systems
• Advanced LED applications for headlamps and rear lights
• Accelerator pedal sensors
• Torque and steering angle sensors for steering systems
• Inductive sensors (e.g. throttle-valve sensors)
• Vacuum pumps for brake boosting
• Actuators for thermal management in cooling circuits

Strategic goals Global leading plant responsible for:

• Lighting electronics
• Inductive sensors
• Accelerator pedal sensors
• Vacuum pumps
• LED applications
• Actuators for thermal management